US 12,444,702 B2
Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate
Rajen Manicon Murugan, Dallas, TX (US); and Yiqi Tang, Allen, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on May 18, 2022, as Appl. No. 17/747,740.
Claims priority of provisional application 63/228,566, filed on Aug. 2, 2021.
Prior Publication US 2023/0044284 A1, Feb. 9, 2023
Int. Cl. H01Q 9/28 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 24/16 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/0913 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/182 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a multilevel package substrate having a first level, a second level, a third level, and a fourth level, the first, second, third, and fourth levels each including a respective dielectric layer and respective patterned conductive features, the first, second, third, and fourth levels extending in respective first, second, third, and fourth planes of a first direction and an orthogonal second direction, the second level between the first and third levels along a third direction that is orthogonal to the first and second directions, and the third level between the second and fourth levels along the third direction;
conductive leads in the fourth level of the multilevel package substrate;
a semiconductor die mounted to the first level of the multilevel package substrate and having conductive pads and conductive terminals coupled to respective ones of the conductive pads;
a package structure that encloses the semiconductor die and a portion of the multilevel package substrate; and
a conductor backed coplanar waveguide transmission line feed, including an interconnect and a conductor, the interconnect including coplanar first, second, and third conductive lines extending in the first level along the first direction from respective ends to an antenna, the second and third conductive lines spaced apart from opposite sides of the first conductive line along the second direction, the ends of the first, second, and third conductive lines coupled to respective ones of the conductive terminals of the semiconductor die, and the conductor extending in the third level of the multilevel package substrate under the interconnect and under the antenna.