US 12,444,701 B2
Semiconductor device with fixed resistance and variable resistance elements
Shinjiro Kato, Tokyo (JP)
Assigned to ABLIC Inc., Nagano (JP)
Filed by ABLIC Inc., Tokyo (JP)
Filed on Mar. 17, 2023, as Appl. No. 18/185,385.
Claims priority of application No. 2022-053127 (JP), filed on Mar. 29, 2022.
Prior Publication US 2023/0317643 A1, Oct. 5, 2023
Int. Cl. H01L 23/64 (2006.01); H10D 1/47 (2025.01); H10D 84/00 (2025.01)
CPC H01L 23/647 (2013.01) [H10D 1/47 (2025.01); H10D 84/209 (2025.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first circuit that comprises a plurality of fixed resistance elements connected in series;
a second circuit that comprises a plurality of variable resistance elements connected in series and that is connected in series to the first circuit;
a first cover portion that is provided on an upper layer side of the first circuit and that covers the first circuit; and
a second cover portion that is provided on an upper layer side of the second circuit and that covers the second circuit,
wherein the first cover portion comprises two or more first metal films electrically connected, correspondingly, to units having any number of the fixed resistance elements, and
the second cover portion comprises a second metal film electrically connected to the plurality of variable resistance elements.