US 12,444,692 B2
Power module comprising a semiconductor module component and an alignment part, and method for forming the power module
Dominik Truessel, Bremgarten (CH); Milad Maleki, Untersiggenthal (CH); Fabian Fischer, Baden (CH); and Lluis Santolaria, Olten (CH)
Assigned to Hitachi Energy Ltd, Zürich (CH)
Appl. No. 19/109,527
Filed by Hitachi Energy Ltd, Zürich (CH)
PCT Filed Aug. 10, 2023, PCT No. PCT/EP2023/072191
§ 371(c)(1), (2) Date Mar. 6, 2025,
PCT Pub. No. WO2024/052044, PCT Pub. Date Mar. 14, 2024.
Claims priority of application No. 22194844 (EP), filed on Sep. 9, 2022.
Prior Publication US 2025/0259941 A1, Aug. 14, 2025
Int. Cl. H01L 23/544 (2006.01); H01L 21/50 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/07 (2006.01); H01L 25/10 (2006.01); H01R 12/58 (2011.01); H05K 7/14 (2006.01)
CPC H01L 23/544 (2013.01) [H01L 21/50 (2013.01); H01L 23/053 (2013.01); H01L 23/3107 (2013.01); H01L 23/552 (2013.01); H01L 25/072 (2013.01); H01L 25/105 (2013.01); H01R 12/585 (2013.01); H05K 7/1432 (2013.01); H01L 2223/54426 (2013.01); H05K 7/142 (2013.01); H05K 2201/2036 (2013.01); H05K 2203/167 (2013.01)] 14 Claims
OG exemplary drawing
 
1. Power module comprising a semiconductor module component and an alignment part, wherein
the alignment part is fixed on a top surface of the semiconductor module component and comprises at least one recessed portion,
the semiconductor module component comprises at least one terminal which has a vertical portion being perpendicular to the top surface of the semiconductor module component and thus is orientated vertically with respect to the top surface of the semiconductor module component, wherein for the purpose of alignment along a lateral direction being parallel to the top surface of the semiconductor module, and for providing the at least one terminal with additional mechanical support along the vertical direction,
the at least one terminal is located at least partly within the at least one recessed portion, along a vertical direction being perpendicular to the top surface of the semiconductor module component, the at least one terminal protrudes beyond the at least one recessed portion, and
the at least one recessed portion is located on a side surface of the alignment part, wherein in a plan view of the top surface of the semiconductor module component, the at least one recessed portion and the at least one terminal are located outside the top surface of the semiconductor module component, wherein the at least one recessed portion is formed as a slot extending along the vertical direction through the alignment part, characterized in that the slot is an open recess on the side surface of the alignment part, and wherein the slot is not a through-hole being completely surrounded by inner walls of the at least one recessed portion in the lateral direction.