US 12,444,673 B2
Electronic package and method for manufacturing the same
Qingyuan Tang, Nijmegen (NL)
Assigned to Nexperia B.V., Nijmegen (NL)
Filed by NEXPERIA B.V., Nijmegen (NL)
Filed on Aug. 30, 2022, as Appl. No. 17/898,883.
Claims priority of application No. 21193724 (EP), filed on Aug. 30, 2021.
Prior Publication US 2023/0066554 A1, Mar. 2, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 23/49844 (2013.01); H01L 24/32 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32238 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/182 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic package comprising:
a first substrate comprising a first dielectric layer;
a second substrate comprising a second dielectric layer, the second substrate being mutually fixated relative to the first substrate;
a first electronic component arranged in between the first and second substrates, the first electronic component having a plurality of first terminals; and
a plurality of first inner contacts, each first inner contact being arranged on the first dielectric layer or the second dielectric layer;
wherein each first terminal among the plurality of first terminals is electrically connected to at least one first inner contact among the plurality of first inner contacts, and wherein each first inner contact among the plurality of first inner contacts is electrically connected to at least one first terminal among the plurality of first terminals;
wherein the electronic package further comprises a plurality of first partial vias, each first partial via having a side wall and being arranged in the first or second dielectric layer, wherein each first inner contact among the plurality of first inner contacts is electrically connected to at least one first partial via among the plurality of first partial vias, wherein the side wall of each first partial via among the plurality of first partial vias, and/or a metal contact layer arranged on the side wall, forms at least part of a first bottom contact of the electronic package and forms at least part of a mounting surface of the electronic package.