US 12,444,671 B2
Semiconductor component with damped bonding surfaces in a package with encapsulated pins
Bernd Kürten, Obermichelbach (DE); and Daniel Kappauf, Gräfenberg (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Appl. No. 18/705,273
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Sep. 27, 2022, PCT No. PCT/EP2022/076838
§ 371(c)(1), (2) Date Apr. 26, 2024,
PCT Pub. No. WO2023/072510, PCT Pub. Date May 4, 2023.
Claims priority of application No. 21205313 (EP), filed on Oct. 28, 2021.
Prior Publication US 2024/0429144 A1, Dec. 26, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/54 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 23/24 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); H10D 12/00 (2025.01); H10D 30/60 (2025.01); H10D 62/832 (2025.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4853 (2013.01); H01L 21/54 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 24/85 (2013.01); H01L 2224/858 (2013.01); H10D 12/411 (2025.01); H10D 30/60 (2025.01); H10D 62/8325 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A housing part for accommodating a semiconductor element, the housing part comprising:
a pin partially molded in the housing part for electrical connection to a printed circuit board, said pin comprising a bonding surface for producing an electrical connection between the pin and the semiconductor element;
a bearing surface for the bonding surface, wherein the housing part comprises the bearing surface for the bonding surface;
a recess formed in the bearing surface, wherein the housing part has the recess in the bearing surface; and
a vibration-damping material at least partially filled in the recess and/or applied in a region adjoining the recess,
wherein the housing part is designed as a one-piece housing frame part.