US 12,444,670 B2
Power module
Ole Mühlfeld, Nordborg (DK); Klaus Olesen, Nordborg (DK); Matthias Beck, Nordborg (DK); Holger Ulrich, Nordborg (DK); and Martin Becker, Nordborg (DK)
Assigned to DANFOSS SILICON POWER GMBH, Flensburg (DE)
Appl. No. 17/909,471
Filed by Danfoss Silicon Power GmbH, Flensburg (DE)
PCT Filed Mar. 8, 2021, PCT No. PCT/EP2021/055804
§ 371(c)(1), (2) Date Sep. 6, 2022,
PCT Pub. No. WO2021/180660, PCT Pub. Date Sep. 16, 2021.
Claims priority of application No. 10 2020 106 385.7 (DE), filed on Mar. 9, 2020.
Prior Publication US 2023/0114396 A1, Apr. 13, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 23/3735 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A power module comprising a rigid insulated substrate mounted on a baseplate, wherein an additional circuit carrier is mounted on the baseplate adjacent to the rigid insulated substrate, wherein the additional circuit carrier has a rigidity which is less than that of the rigid insulated substrate.