US 12,444,669 B2
Semiconductor devices with floating pad and their methods of manufacturing
Dae Young Park, Jeollanam-do (KR); Gi Jeong Kim, Gyeonggi-do (KR); Hyeong Il Jeon, Gyeonggi-do (KR); and Kwang Soo Sang, Incheon (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Dec. 19, 2022, as Appl. No. 18/084,143.
Prior Publication US 2024/0203847 A1, Jun. 20, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/498 (2013.01) [H01L 21/485 (2013.01); H01L 21/56 (2013.01); H01L 23/3178 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate comprising a first side and a second side opposite the first side, wherein the substrate comprises a first groove at the second side of the substrate;
a first electronic component over the first side of the substrate; and
a resin in the first groove;
wherein the substrate comprises a floating pad at the first side of the substrate, a second groove at the first side of the substrate, and a third groove at the first side of the substrate, wherein the floating pad is between the second groove and the third groove.