US 12,444,666 B2
Semiconductor device with bent terminals
Kazuki Koda, Tokyo (JP); Shuhei Yokoyama, Tokyo (JP); Naoki Ikeda, Tokyo (JP); Shogo Shibata, Tokyo (JP); and Keitaro Ichikawa, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Aug. 23, 2022, as Appl. No. 17/821,679.
Claims priority of application No. 2021-189315 (JP), filed on Nov. 22, 2021.
Prior Publication US 2023/0163051 A1, May 25, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49562 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor element;
a mold member covering the semiconductor element; and
a first terminal and a second terminal electrically connected to the semiconductor element, protruding from one side of the mold member, and adjacent to each other along the one side, wherein
the first terminal includes a first bend, and
the second terminal includes:
a second bend located further from the one side of the mold member than the first bend, and having the same width as the first bend in plan view; and
a portion located between the one side of the mold member and the second bend of the second terminal, and being wider than the second bend, wherein the portion and the first bend have a same distance to the one side of the mold member.