US 12,444,661 B2
Pattern design for integrated circuits and method for inspecting the pattern design for integrated circuits
Jong Soo Baek, Hwaseong-si (KR); Jin Myoung Lee, Hwaseong-si (KR); Min Soo Kang, Hwaseong-si (KR); Hyun Ah Roh, Hwaseong-si (KR); and Bo Young Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 25, 2022, as Appl. No. 17/704,620.
Application 17/704,620 is a continuation of application No. 16/596,657, filed on Oct. 8, 2019, granted, now 11,315,841.
Claims priority of application No. 10-2019-0045659 (KR), filed on Apr. 18, 2019.
Prior Publication US 2022/0216120 A1, Jul. 7, 2022
Int. Cl. H01L 21/66 (2006.01); G01N 23/2251 (2018.01); G01R 31/28 (2006.01); H01L 23/528 (2006.01)
CPC H01L 22/34 (2013.01) [G01N 23/2251 (2013.01); G01R 31/2884 (2013.01); H01L 23/528 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A defect inspection method of a pattern design for an inspection apparatus including a controller, the defect inspection method comprising:
scanning, by the controller, a main pad region using a particle beam to generate main pad information,
wherein the pattern design comprises a plurality of conductive lines,
wherein the main pad region is arranged at a first end portion of the plurality of conductive lines, and
wherein the plurality of conductive lines respectively comprise a plurality of main pads positioned in the main pad region;
scanning, by the controller, a first sub-pad region at a first end portion of a first subregion of the pattern design using the particle beam to generate first sub-pad information,
wherein the first sub-pad region is intermediate between the first end portion of the plurality of conductive lines and a second end portion of the plurality of conductive lines,
wherein the plurality of conductive lines respectively comprise a plurality of sub-pads positioned in the first sub-pad region,
wherein a width of each of the plurality of main pads is larger than a width of an adjacent portion of the conductive line that comprises the main pad,
wherein a width of each of the plurality of sub-pads is larger than a width of an adjacent portion of the conductive line that comprises the sub-pad, and
wherein a first conductive line of the plurality of conductive lines comprises:
a first branch line extending from a main line of the first conductive line, and
a first sub-pad, of the plurality of sub-pads, positioned at an end portion of the first branch line; and
determining, by the controller, a state of the pattern design based on the main pad information and the first sub-pad information.
 
7. A defect inspection method of a pattern design for an inspection apparatus including a controller, the defect inspection method comprising:
scanning, by the controller, a main pad region of the pattern design using a particle beam to generate main pad information, wherein the main pad region comprises a plurality of main pads;
scanning, by the controller, a first sub-pad region of the pattern design using the particle beam to generate first sub-pad information, wherein the first sub-pad region comprises a plurality of sub-pads,
wherein the pattern design comprises a plurality of conductive lines,
wherein the first sub-pad region is intermediate between a first end portion of the plurality of conductive lines and a second end portion of the plurality of conductive lines,
wherein the plurality of conductive lines respectively comprise the plurality of main pads and respectively comprise the plurality of sub-pads,
wherein a width of each of the plurality of main pads is larger than a width of an adjacent portion of the conductive line that comprises the main pad,
wherein a width of each of the plurality of sub-pads is larger than a width of an adjacent portion of the conductive line that comprises the sub-pad, and
wherein a first conductive line of the plurality of conductive lines comprises:
a first branch line extending from a main line of the first conductive line, and
a first sub-pad, of the plurality of sub-pads, positioned at an end portion of the first branch line; and
determining, by the controller, a state of the pattern design based on the main pad information and the first sub-pad information.
 
13. A defect inspection method of a pattern design for an inspection apparatus including a controller, the defect inspection method comprising:
scanning, by the controller, a plurality of main pads of the pattern design using a particle beam to generate main pad information;
scanning, by the controller, a plurality of sub-pads of the pattern design using the particle beam to generate sub-pad information; and
determining, by the controller, a state of the pattern design based on the main pad information and the sub-pad information,
wherein the pattern design comprises a main pad region, a ground region, and a sub-pad region positioned between the main pad region and the ground region,
wherein the pattern design comprises a plurality of conductive lines,
wherein the plurality of conductive lines respectively comprise the plurality of main pads in the main pad region and respectively comprise the plurality of sub-pads in the sub-pad region,
wherein a width of each of the plurality of main pads is larger than a width of an adjacent portion of the conductive line comprising the main pad,
wherein a width of each of the plurality of sub-pads is larger than a width of an adjacent portion of the conductive line comprising the sub-pad, and
wherein a first conductive line of the plurality of conductive lines comprises:
a first branch line extending from an intermediate position of a main line of the first conductive line, and
a first sub-pad, of the plurality of sub-pads, positioned at an end portion of the first branch line.