US 12,444,658 B2
Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices
Jeremiah J. Schley, Dublin, OH (US); Thomas Kent, Columbus, OH (US); Katie T. Liszewski, Powell, OH (US); and Isaac Goldthwaite, Columbus, OH (US)
Assigned to Battelle Memorial Institute, Columbus, OH (US)
Filed by Battelle Memorial Institute, Columbus, OH (US)
Filed on Mar. 30, 2022, as Appl. No. 17/708,329.
Application 17/708,329 is a continuation of application No. 16/881,848, filed on May 22, 2020, granted, now 11,315,840.
Claims priority of provisional application 62/851,777, filed on May 23, 2019.
Prior Publication US 2022/0223484 A1, Jul. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/66 (2006.01); B23C 3/00 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01)
CPC H01L 22/26 (2013.01) [B23C 3/007 (2013.01); H01L 21/3043 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An assembly for monitoring a semiconductor device during milling comprising:
a micromill, wherein:
the micromill configured to hold a socket,
the socket configured to receive the semiconductor device,
the micromill employing milling fluid,
the semiconductor device including electrical contacts, and
the socket preventing contamination of the electrical contacts by the milling fluid;
a signal generator configured to send a signal to the semiconductor device to produce an electrical characteristic of the semiconductor device;
a sensor configured to sense the electrical characteristic during milling of the semiconductor device in a mill and provide a sensor output representative of the electrical characteristic, the mill including a support for the semiconductor device that moves in X, Y and Z directions of a milling surface, and
a computer configured to stop the milling based on the sensor output.