US 12,444,642 B2
Robotic arm and apparatus for treating substrate including the same
Tae Hoon Lee, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Dec. 21, 2022, as Appl. No. 18/086,633.
Claims priority of application No. 10-2022-0039000 (KR), filed on Mar. 29, 2022.
Prior Publication US 2023/0317504 A1, Oct. 5, 2023
Int. Cl. H01L 21/687 (2006.01); B25J 11/00 (2006.01); B25J 18/00 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/68707 (2013.01) [B25J 11/0095 (2013.01); B25J 18/00 (2013.01); H01L 21/67742 (2013.01); H01L 21/67766 (2013.01); H01L 21/6838 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A robotic arm, comprising:
an arm body; and
a plurality of pads connected to the arm body and in contact with a substrate,
wherein the arm body includes a ceramic plate and an antistatic coating layer disposed on an external surface of the ceramic plate,
wherein the pad includes a first conductive layer, and
wherein a conductive portion connecting the pad to the antistatic coating layer on an external side of the pad is provided,
wherein the ceramic plate includes first and second ceramic plates, and an intake flow path is formed between the first and second ceramic plates,
wherein the pad includes a through-hole communicating with the intake flow path,
wherein the pad is connected to the first ceramic plate, and
wherein the first ceramic plate includes an adhesive portion without the antistatic coating layer on an external surface, and the pad is adhered to the first ceramic plate in the adhesive portion.