US 12,444,639 B2
Semiconductor device and method for reducing metal burrs using laser grooving
ChangOh Kim, Incheon (KR); JinHee Jung, Incheon (KR); DaePark Lee, Gyeonggi-do (KR); YoungKang Lee, Incheon (KR); and YongJin Jeong, Incheon (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Dec. 1, 2021, as Appl. No. 17/457,074.
Prior Publication US 2023/0170245 A1, Jun. 1, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 23/552 (2006.01)
CPC H01L 21/6836 (2013.01) [H01L 21/4814 (2013.01); H01L 23/552 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
providing a jig including a metal frame, a polymer film, and an adhesive layer disposed between the metal frame and polymer film;
forming an opening through the adhesive layer and polymer film;
forming a groove in the adhesive layer and polymer film around the opening;
disposing a semiconductor package on a top surface of the adhesive layer of the jig over the opening with a portion of the top surface remaining exposed between a side surface of the semiconductor package and the groove, wherein the groove is formed in the adhesive layer and polymer film prior to disposing the semiconductor package on the adhesive layer;
forming a shielding layer over the semiconductor package and jig, wherein a portion of the shielding layer extends into the groove; and
removing the semiconductor package from the jig after forming the shielding layer, wherein the portion of the shielding layer remains in the groove.