US 12,444,638 B2
Chip wet transfer method and equipment using magnetic force
Youngtek Oh, Suwon-si (KR); Kyungwook Hwang, Suwon-si (KR); Dongho Kim, Suwon-si (KR); Joonyong Park, Suwon-si (KR); Sanghoon Song, Suwon-si (KR); Minchul Yu, Suwon-si (KR); and Junsik Hwang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 15, 2024, as Appl. No. 18/442,908.
Claims priority of application No. 10-2023-0084526 (KR), filed on Jun. 29, 2023.
Prior Publication US 2025/0006542 A1, Jan. 2, 2025
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 25/075 (2006.01)
CPC H01L 21/6835 (2013.01) [H01L 21/67132 (2013.01); H01L 21/68 (2013.01); H01L 25/0753 (2013.01); H01L 2221/68313 (2013.01); H01L 2221/68381 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor chip wet transfer method comprising:
preparing a transfer substrate that includes a plurality of recesses;
supplying a liquid that includes semiconductor chips onto the plurality of recesses of the transfer substrate;
aligning the semiconductor chips in the plurality of recesses by sweeping, with an align bar, an upper surface of the transfer substrate supplied with the liquid; and
performing cleaning by removing semiconductor chips that are not aligned in the plurality of recesses by using a first magnetic force generating device disposed facing a lower surface of the transfer substrate.