US 12,444,637 B2
Substrate for manufacturing display device and a manufacturing method using the same
Jaewon Chang, Seoul (KR); Hyunho Lee, Seoul (KR); and Soohyun Kim, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 17/798,219
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Feb. 26, 2021, PCT No. PCT/KR2021/002468
§ 371(c)(1), (2) Date Aug. 8, 2022,
PCT Pub. No. WO2021/177673, PCT Pub. Date Sep. 10, 2021.
Claims priority of application No. 10-2020-0026189 (KR), filed on Mar. 2, 2020.
Prior Publication US 2023/0119947 A1, Apr. 20, 2023
Int. Cl. H01L 21/683 (2006.01); H10H 20/01 (2025.01); H10H 29/14 (2025.01)
CPC H01L 21/6835 (2013.01) [H10H 20/01 (2025.01); H10H 29/142 (2025.01); H01L 2221/68309 (2013.01); H01L 2221/68368 (2013.01); H10H 20/032 (2025.01)] 18 Claims
OG exemplary drawing
 
1. A display device manufacturing substrate used to manufacture a display device including a semiconductor light-emitting device package comprising a plurality of electrodes and a plurality of semiconductor light-emitting devices connected to the electrodes, the substrate comprising:
a base portion;
lower assembly electrodes extending in one direction, and on the base portion;
a first insulating layer to cover the lower assembly electrodes;
upper assembly electrodes extending in a same direction as the lower assembly electrodes, and on the first insulating layer to overlap with the lower assembly electrodes;
a second insulating layer on the first insulating layer to cover the upper assembly electrodes and including a plurality of holes configured to accommodate electrodes of the semiconductor light-emitting device package; and
a partition wall portion on the second insulating layer and forming a cell configured to accommodate the semiconductor light-emitting device package,
wherein the cell comprises the plurality of holes in the cell, and
wherein, at the holes, the second insulating layer contacts the first insulating layer.