US 12,444,636 B2
Electrostatic chuck with a charge dissipation structure
Jakub Rybczynski, Arlington, MA (US); Steven Donnell, Burlington, MA (US); Yan Liu, Lexington, MA (US); Caleb Minsky, Medfield, MA (US); Chandra Venkatraman, Tyngsboro, MA (US); and Carlo Waldfried, Middleton, MA (US)
Assigned to ENTEGRIS, INC., Billerica, MA (US)
Filed by ENTEGRIS, INC., Billerica, MA (US)
Filed on Feb. 24, 2023, as Appl. No. 18/113,941.
Claims priority of provisional application 63/314,774, filed on Feb. 28, 2022.
Prior Publication US 2023/0274967 A1, Aug. 31, 2023
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 19 Claims
OG exemplary drawing
 
1. An electrostatic chuck comprising:
an insulating layer at an upper surface of the electrostatic chuck,
a charge dissipation structure on the insulating layer, the charge dissipation structure comprising:
a first conductive layer on the insulator layer having a first resistivity, and
a second conductive layer over the first conductive layer, having a second resistivity, wherein the second resistivity is higher than the first resistivity,
the charge dissipation structure comprising interconnecting topographies extending over an upper surface of the insulating layer, the interconnecting topographies including interconnected segments or lines that intersect to enclose and define multiple exposed areas of the insulating layer, and
one or more electrodes beneath the insulating layer, wherein the interconnecting topographies are located directly above the one or more electrodes.