US 12,444,635 B2
Substrate support and substrate processing apparatus
Hideto Saito, Miyagi (JP); Makoto Kato, Miyagi (JP); Shin Yamaguchi, Miyagi (JP); Takashi Kanazawa, Miyagi (JP); and Ryoma Muto, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jun. 22, 2022, as Appl. No. 17/846,605.
Claims priority of application No. 2021-103904 (JP), filed on Jun. 23, 2021.
Prior Publication US 2022/0415693 A1, Dec. 29, 2022
Int. Cl. H01L 21/683 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32522 (2013.01); H01L 21/67109 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate support comprising:
an electrostatic chuck formed of ceramics and holding a substrate by electrostatic attraction;
a base supporting the electrostatic chuck; and
a flow path through which a heat exchange medium flows, the flow path being formed in the base,
wherein an upper surface of the flow path is formed of ceramics forming the electrostatic chuck, and
wherein the electrostatic chuck includes a ring support surface and the flow path is also formed in the ring support surface.