US 12,444,633 B2
Workpiece handling system, method of calibrating workpiece handling system and method of manufacturing semiconductor package
Ta-Meng Kuan, Taoyuan (TW); Yi-Neng Chang, Hsinchu County (TW); and Ting-Yu Chiu, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 30, 2021, as Appl. No. 17/460,341.
Prior Publication US 2023/0065638 A1, Mar. 2, 2023
Int. Cl. H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67766 (2013.01) [H01L 21/67745 (2013.01); H01L 21/681 (2013.01); H01L 21/68707 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A workpiece handling system, comprising:
a carrier carrying at least one workpiece;
a lower imaging device disposed beside the carrier, wherein the lower imaging device comprises a calibration plate having a plate alignment mark; and
a transfer mechanism movably disposed over the lower imaging device and the carrier, wherein the transfer mechanism comprises an end effector configured to pick and place the at least one workpiece and an upper imaging device disposed beside the end effector.