US 12,444,631 B2
Substrate support device
Wataru Omuro, Hiratsuka (JP); and Atsushi Kobayashi, Hiratsuka (JP)
Assigned to KELK Ltd., Hiratsuka (JP)
Filed by KELK Ltd., Hiratsuka (JP)
Filed on Jan. 21, 2022, as Appl. No. 17/580,836.
Claims priority of application No. 2021-013315 (JP), filed on Jan. 29, 2021.
Prior Publication US 2022/0246459 A1, Aug. 4, 2022
Int. Cl. H01L 21/677 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67742 (2013.01) [H01L 21/67288 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate support device comprising:
a placement portion formed in a plate shape which extends in a horizontal direction and having a placement surface on which a substrate is placed, the placement portion including a low-rigidity portion having a lower rigidity than a remainder of the placement portion configured to allow the placement portion to partially deform; and
a movable portion which makes the placement surface conform to the substrate by moving with to a warpage of the substrate placed on the placement surface,
wherein:
the movable portion includes an arm part including,
an expansion and contraction section which expands and contracts in the horizontal direction according to the warpage of the substrate placed on the placement surface,
an arm having a longitudinal direction in a vertical direction in a state in which the substrate is not placed on the placement surface, and
an arm connector which connects a lower end of the arm to an outer end of the expansion and contraction section in the horizontal direction, and
configured to move according to expansion and contraction of the expansion and contraction section, and
an upper connector which is connected to an upper portion of the arm and causes the placement portion to bend according to movement of the arm.