US 12,444,629 B2
Substrate inspection device
Yoshihiro Satou, Tokyo (JP); Toshio Masuda, Tokyo (JP); Akio Yazaki, Tokyo (JP); and Kenshiro Ohtsubo, Tokyo (JP)
Assigned to Hitachi High-Tech Corporation, Tokyo (JP)
Appl. No. 17/783,202
Filed by Hitachi High-Tech Corporation, Tokyo (JP)
PCT Filed Dec. 24, 2019, PCT No. PCT/JP2019/050696
§ 371(c)(1), (2) Date Jun. 7, 2022,
PCT Pub. No. WO2021/130870, PCT Pub. Date Jul. 1, 2021.
Prior Publication US 2023/0017599 A1, Jan. 19, 2023
Int. Cl. H01L 21/67 (2006.01); G01N 21/95 (2006.01)
CPC H01L 21/67288 (2013.01) [G01N 21/9501 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A substrate inspection device comprising:
a turntable on which a substrate to be inspected is mounted; and
a clamp mechanism to hold the substrate on the turntable,
wherein
the clamp mechanism includes an abutting part that moves in an in-plane direction of the substrate and that presses the substrate,
wherein
the turntable is configured to be approximately the same size as the substrate, and
the clamp mechanism is located on an outer periphery of the turntable and is configured to suppress deformation of the substrate.