US 12,444,625 B2
Chip peeling apparatus and chip peeling method using the same
Tatsuya Ishimoto, Yokohama (JP); Naoyuki Takada, Yokohama (JP); Takahiro Tokumiya, Yokohama (JP); and Masato Kajinami, Yokohama (JP)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 7, 2022, as Appl. No. 18/062,830.
Claims priority of application No. 2021-199182 (JP), filed on Dec. 8, 2021; and application No. 10-2022-0130919 (KR), filed on Oct. 12, 2022.
Prior Publication US 2023/0178394 A1, Jun. 8, 2023
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67132 (2013.01) 16 Claims
OG exemplary drawing
 
1. A chip peeling apparatus comprising:
a peeling device,
the peeling device including a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged surrounding the plurality of vacuum adsorption holes,
wherein the peeling device is configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape,
the peeling device comprises a peeling body,
the plurality of vacuum adsorption holes comprise a first vacuum adsorption hole passing through the peeling body from a top surface of the peeling body to a bottom surface of the peeling body, a second vacuum adsorption hole passing through the peeling body from the top surface of the peeling body to a first side surface of the peeling body, and a third vacuum adsorption hole passing through the peeling body from the top surface of the peeling body to a second side surface of the peeling body, and
the second side surface of the peeling body is opposite the first side surface of the peeling body.