US 12,444,591 B2
Diagnosis device, diagnosis method, plasma processing apparatus, and semiconductor device manufacturing system
Shota Umeda, Tokyo (JP); Kenji Tamaki, Tokyo (JP); Masahiro Sumiya, Tokyo (JP); and Yoshito Kamaji, Tokyo (JP)
Assigned to Hitachi High-Tech Corporation, Tokyo (JP)
Appl. No. 17/908,306
Filed by Hitachi High-Tech Corporation, Tokyo (JP)
PCT Filed Jul. 13, 2021, PCT No. PCT/JP2021/026208
§ 371(c)(1), (2) Date Aug. 31, 2022,
PCT Pub. No. WO2023/286142, PCT Pub. Date Jan. 19, 2023.
Prior Publication US 2024/0213003 A1, Jun. 27, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32963 (2013.01) [H01J 37/32935 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A maker-side diagnosis device that diagnoses the deterioration states of a plurality of components of a plasma processing apparatus, the maker-side diagnosis device comprising:
a network interface for receiving, from a user-side diagnosis device, a deterioration degree computed by the user-side diagnosis device for each of the components based on a plurality of sensor values obtained by the user-side diagnosis device from a corresponding plurality of state sensors of the plasma processing apparatus; and
an analysis unit that calculates a robustness degree with respect to each of the components under a plurality of computation conditions for which the deterioration degree of the components has been calculated by the user-side diagnosis device, selects one computation condition from the plurality of computation conditions with respect to each of the components on the basis of the calculated robustness degree, and diagnoses the deterioration states of each of the components by using the selected computation condition in a state of not having received the plurality of sensor values by the maker-side diagnosis device,
wherein the robustness degree is an index indicating the shareability of the tendency of the degradation degree for a plurality of maintenance cases of the plasma processing apparatus.