US 12,444,590 B2
Plasma sensor module
Sungwon Cho, Suwon-si (KR); Dohoon Kwon, Suwon-si (KR); Kyunghyun Kim, Suwon-si (KR); Dougyong Sung, Suwon-si (KR); Jungmo Yang, Suwon-si (KR); Younseon Wang, Suwon-si (KR); and Younsok Choi, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 23, 2023, as Appl. No. 18/188,540.
Claims priority of application No. 10-2022-0109055 (KR), filed on Aug. 30, 2022.
Prior Publication US 2024/0071737 A1, Feb. 29, 2024
Int. Cl. H01J 37/32 (2006.01); G01N 9/00 (2006.01)
CPC H01J 37/32917 (2013.01) [G01N 9/00 (2013.01); H01J 2237/24585 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A plasma sensor module comprising:
an upper substrate that is configured to be exposed to plasma;
a lower substrate configured to contact a lower surface of the upper substrate, the lower substrate having a thickness that is thicker than a thickness of the upper substrate;
at least one probe in the lower substrate; and
a printed circuit board (PCB) in the lower substrate, wherein the PCB is configured to apply an alternating current to the at least one probe to detect a density of the plasma, the at least one probe is below an uppermost surface of the lower substrate, and a lower surface of the upper substrate is entirely planar.