US 12,444,587 B2
Wafer placement table with heat dissipation sheet
Tatsuya Kuno, Nagoya (JP); Taro Usami, Kakamigahara (JP); and Masaki Ishikawa, Handa (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK Insulators, Ltd., Nagoya (JP)
Filed on Feb. 9, 2023, as Appl. No. 18/166,652.
Application 18/166,652 is a continuation of application No. PCT/JP2022/033051, filed on Sep. 2, 2022.
Prior Publication US 2024/0079217 A1, Mar. 7, 2024
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01)
CPC H01J 37/32724 (2013.01) [H01L 21/6833 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A wafer placement table comprising:
an upper substrate including a ceramic substrate that incorporates an electrode and having a wafer placement surface at an upper surface of the ceramic substrate;
a lower substrate disposed on a side of a lower surface of the upper substrate and including a refrigerant flow path through which a refrigerant flow or a refrigerant flow-path groove constituting a side wall and a bottom of the refrigerant flow path;
a through hole extending through the lower substrate in an up-down direction;
a plurality of projections provided in a dot pattern at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate or provided in a dot pattern at an entirety of the lower surface of the upper substrate and being in contact with the upper surface of the lower substrate;
a heat dissipation sheet having a plurality of projection insertion holes that extend through the thickness of the heat dissipation sheet in the up-down direction and into which the plurality of projections are to be inserted and being disposed in a compressed state between a full width of the upper substrate and the lower substrate in vertical cross-sectional view of the wafer placement table;
a screw hole provided, in the lower surface of the upper substrate, at a position facing the through hole;
a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole.