US 12,444,541 B2
Multilayer electronic component
Chung Yeol Lee, Suwon-si (KR); Jun Il Kang, Suwon-si (KR); Hee Jung Jung, Suwon-si (KR); Jong Rock Lee, Suwon-si (KR); Cheong Kim, Suwon-si (KR); and Hiroki Okada, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 17, 2023, as Appl. No. 18/235,064.
Claims priority of application No. 10-2023-0042918 (KR), filed on Mar. 31, 2023.
Prior Publication US 2024/0331946 A1, Oct. 3, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/08 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and internal electrodes; and
an external electrode disposed on the body,
wherein a lattice-type groove shape having a plurality of grooves arranged in a lattice form is formed in at least a portion of a surface of the body, and
when a maximum length of the lattice-type groove shape is defined as L based on a plan view, L≤10 μm is satisfied.