US 12,444,540 B2
Multilayer electronic component with curved side surfaces
Chang Ho Seo, Suwon-si (KR); and Sung Kwon An, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 12, 2022, as Appl. No. 18/079,449.
Claims priority of application No. 10-2021-0189812 (KR), filed on Dec. 28, 2021; and application No. 10-2022-0095543 (KR), filed on Aug. 1, 2022.
Prior Publication US 2023/0207221 A1, Jun. 29, 2023
Int. Cl. H01G 4/30 (2006.01); B23K 26/38 (2014.01); H01G 4/012 (2006.01)
CPC H01G 4/30 (2013.01) [B23K 26/38 (2013.01); H01G 4/012 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a ceramic body including a dielectric layer and a plurality of first and second internal electrodes stacked in a first direction with the dielectric layer interposed therebetween; and
first and second external electrodes connected to the first and second internal electrodes, respectively,
wherein the first and second internal electrodes extend to a first side and a second side of the ceramic body, respectively,
wherein the ceramic body includes a plurality of curved surfaces disposed on the first side and a plurality of curved surfaces disposed on the second side,
wherein curvature of the plurality of curved surfaces disposed on the first and second sides is along the first direction,
wherein at least a portion of regions connected to each other in the plurality of curved surfaces on the first side is a discontinuous region, and at least a portion of regions connected to each other in the plurality of curved surfaces on the second side is a discontinuous region.