| CPC H01G 4/30 (2013.01) [C04B 35/64 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 13/006 (2013.01)] | 12 Claims |

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1. A method for manufacturing a multilayer ceramic electronic component, comprising:
forming a conductive paste for internal electrodes on a ceramic green sheet;
forming a ceramic laminate by laminating a plurality of the ceramic green sheets;
forming a ceramic body including a dielectric layer and a plurality of internal electrodes by sintering the ceramic laminate;
trimming at least one surface of the ceramic body; and
forming at least one external electrode on the at least one trimmed surface of the ceramic body,
wherein the ceramic body comprises a first surface and a second surface opposing each other,
wherein the forming at least one external electrode includes forming first and second external electrodes on the first and second surfaces, respectively,
wherein, when a stacking direction of the plurality of internal electrodes is a first direction and a direction perpendicular to the first and second surfaces is a second direction, the ceramic body comprises regions having different lengths in the second direction, and
wherein the trimming includes removing a portion of a region having a longer length in the second direction, among the regions of the ceramic body, from the ceramic body.
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