US 12,444,534 B2
Mounting structure and mounting method of electronic component
Daichi Satou, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Mar. 15, 2023, as Appl. No. 18/121,635.
Claims priority of application No. 2022-044344 (JP), filed on Mar. 18, 2022.
Prior Publication US 2023/0298814 A1, Sep. 21, 2023
Int. Cl. H01G 2/06 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H01G 2/065 (2013.01) [H01G 4/1227 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A mounting structure of an electronic component comprising:
at least two electrode pads spaced apart from each other on a board;
at least two external electrodes of the electronic component respectively connected to the at least two electrode pads; and
a resist film provided around each of the at least two electrode pads on a surface of the board; wherein
a predetermined separation distance in a surface direction of the board is set between the resist film and each of the at least two external electrodes provided respectively on the at least two electrode pads;
the separation distance is about 30.8% or more of a dimensional tolerance of the electronic component;
at least a surface layer of each of the at least two external electrodes includes about 99 wt % or more of Sn; and
the at least two external electrodes are respectively connected to the at least two electrode pads by a bonding material, and a largest portion of the bonding material is provided at a mounting surface of the at least two external electrodes that faces the at least two electrode pads.