US 12,444,533 B2
High-frequency module and communication apparatus
Terumichi Kita, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Apr. 21, 2022, as Appl. No. 17/660,032.
Application 17/660,032 is a continuation of application No. PCT/JP2020/040407, filed on Oct. 28, 2020.
Claims priority of application No. 2019-230972 (JP), filed on Dec. 20, 2019.
Prior Publication US 2022/0246345 A1, Aug. 4, 2022
Int. Cl. H01F 27/28 (2006.01); H01F 38/14 (2006.01); H03F 1/26 (2006.01)
CPC H01F 27/2885 (2013.01) [H01F 38/14 (2013.01); H03F 1/26 (2013.01); H03F 2200/294 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A high-frequency module comprising:
a mounting substrate having a main surface;
a first inductor located on a main surface side of the mounting substrate facing the main surface;
a second inductor located on the main surface side of the mounting substrate;
at least one high-frequency component located on the main surface side of the mounting substrate and between the first inductor and the second inductor;
a shield layer connected to ground; and
a conductive member connecting the high-frequency component and the shield layer,
wherein the conductive member is connected to a main surface of the high-frequency component, the main surface of the high-frequency component facing the shield layer,
wherein in a depth direction of the mounting substrate, a height of the high-frequency component is lower than at least one of a height of the first inductor and a height of the second inductor.