| CPC H01F 27/2804 (2013.01) [H01F 27/266 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H05K 1/18 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/10515 (2013.01)] | 20 Claims |

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1. An embedded magnetic component device comprising:
an insulating substrate including a first side, a second side opposite the first side, and a cavity;
a magnetic core included in the cavity and including an inner periphery and an outer periphery;
a first electrical winding that extends through the insulating substrate and around the magnetic core; and
a second electrical winding that extends through the insulating substrate and around the magnetic core, wherein
each of the first and the second electrical windings includes:
upper traces located on the first side of the insulating substrate;
lower traces located on the second side of the insulating substrate;
inner conductive connectors extending through the insulating substrate adjacent to the inner periphery of the magnetic core, the inner conductive connectors respectively defining electrical connections between respective upper traces and respective lower traces; and
outer conductive connectors extending through the insulating substrate adjacent to the outer periphery of the magnetic core, the outer conductive connectors respectively defining electrical connections between the respective upper traces and the respective lower traces,
the first electrical winding is closer to the magnetic core than the second electrical winding.
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