US 12,444,530 B2
Multilayer coil component
Hidekazu Sato, Tokyo (JP); Takahiro Sato, Tokyo (JP); Hitoshi Kudo, Tokyo (JP); Takashi Endo, Tokyo (JP); Yusuke Nagai, Tokyo (JP); Tatsuro Suzuki, Tokyo (JP); Hiroko Korikawa, Tokyo (JP); and Kenji Komorita, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Sep. 13, 2023, as Appl. No. 18/367,503.
Application 18/367,503 is a continuation of application No. 16/666,555, filed on Oct. 29, 2019, granted, now 11,810,704.
Claims priority of application No. 2018-204162 (JP), filed on Oct. 30, 2018.
Prior Publication US 2023/0420172 A1, Dec. 28, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 17/00 (2006.01); H01F 5/00 (2006.01); H01F 17/04 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01)
CPC H01F 17/0013 (2013.01) [H01F 5/003 (2013.01); H01F 17/04 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A multilayer coil component comprising:
an element body having a multilayer structure including:
a first element body portion formed of a first material; and
a second element body portion laminated on the first element body portion and formed of a second material having a composition different from that of the first material;
a multilayer coil having an axis parallel to a lamination direction of the element body;
a stress alleviation portion provided in an inner region of an inner edge of the multilayer coil when viewed from the lamination direction,
wherein the stress alleviation portion is separated from all conductor patterns forming the multilayer coil by either the first material or the second material constituting the element body,
wherein the stress alleviation portion is formed in the same layer as the conductive pattern constituting the multilayer coil, and
wherein the stress alleviation portion is provided on a coil axis of the multilayer coil.