US 12,444,529 B2
Multilayer coil component
Yusuke Nagai, Tokyo (JP); Hidekazu Sato, Tokyo (JP); Kazuhiro Ebina, Tokyo (JP); Kunihiko Kawasaki, Tokyo (JP); Takahiro Sato, Tokyo (JP); Kouichi Kakuda, Tokyo (JP); Yuya Ishima, Tokyo (JP); Shinichi Kondo, Tokyo (JP); Shinichi Sato, Tokyo (JP); and Masaki Takahashi, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Feb. 7, 2022, as Appl. No. 17/666,170.
Claims priority of application No. 2021-031806 (JP), filed on Mar. 1, 2021.
Prior Publication US 2022/0277879 A1, Sep. 1, 2022
Int. Cl. H01F 27/29 (2006.01); H01F 5/06 (2006.01); H01F 17/00 (2006.01)
CPC H01F 17/0013 (2013.01) [H01F 5/06 (2013.01); H01F 27/292 (2013.01); H01F 2017/002 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multilayer coil component comprising a coil portion in an insulating element body forming a multilayer structure, wherein
the coil portion has a plurality of sets including first and second conductor pattern layers respectively having first and second conductor patterns,
the first conductor pattern and the second conductor pattern respectively have parallel parts overlapping in a lamination direction, non-parallel parts not overlapping in the lamination direction, and pad portions used for inter-conductor pattern connection,
in one set, first pad portions provided at the parallel part of the first conductor pattern and the parallel part of the second conductor pattern are connected to each other via a first through hole,
a second pad portion provided at the non-parallel part of the first conductor pattern of the one set and a third pad portion provided at the non-parallel part of the second conductor pattern of a set positioned on one side in the lamination direction with respect to the one set are connected via a second through hole, and
the third pad portion provided at the non-parallel part of the second conductor pattern of the one set and the second pad portion provided at the non-parallel part of the first conductor pattern of a set positioned on the other side in the lamination direction with respect to the one set are connected via the second through hole, and
wherein a void exists between layers of the second pad portion and the third pad portion in the one set.