US 12,444,368 B2
Display backplane and manufacturing method thereof and display device
Liang Chen, Beijing (CN); Ke Wang, Beijing (CN); Haoliang Zheng, Beijing (CN); Minghua Xuan, Beijing (CN); Dongni Liu, Beijing (CN); Hao Chen, Beijing (CN); and Qi Qi, Beijing (CN)
Assigned to Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Appl. No. 17/789,193
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Aug. 16, 2021, PCT No. PCT/CN2021/112692
§ 371(c)(1), (2) Date Jun. 25, 2022,
PCT Pub. No. WO2022/057542, PCT Pub. Date Mar. 24, 2022.
Claims priority of application No. 202010968648.3 (CN), filed on Sep. 15, 2020.
Prior Publication US 2023/0043192 A1, Feb. 9, 2023
Int. Cl. H10K 59/131 (2023.01); G09G 3/3233 (2016.01); G09G 3/3258 (2016.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); G11C 19/28 (2006.01)
CPC G09G 3/3258 (2013.01) [G09G 3/3233 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 25/167 (2013.01); H10D 86/0214 (2025.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); G09G 2300/0426 (2013.01); G09G 2300/0819 (2013.01); G09G 2300/0852 (2013.01); G09G 2310/0286 (2013.01); G09G 2310/08 (2013.01); G09G 2320/0233 (2013.01); G11C 19/287 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/06182 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A display backplane, comprising a base, and
a plurality of pixel circuits, a plurality of bonding electrodes, and a plurality of bonding connection wires on the base, wherein
the plurality of bonding electrodes are coupled to the plurality of bonding connection wires in a one-to-one correspondence;
the plurality of bonding electrodes and the plurality of bonding connection wires are on two opposite surfaces of the base, respectively,
the plurality of pixel circuits and the plurality of bonding connection wires are on a same side of the base;
one end of each of the plurality of bonding connection wires is coupled to the bonding electrode through a first via in the base;
the other end of each of at least some of the plurality of bonding connection wires is coupled to the pixel circuit; and
an orthographic projection of at least one of the plurality of bonding electrodes and the plurality of bonding connection wires on the base is not coincident with an orthographic projection of the pixel circuit on the base,
wherein the display backplane further comprises a plurality of dummy circuits on the base, and
wherein the orthographic projection of at least one of the plurality of bonding electrodes and the plurality of bonding connection wires on the base overlaps an orthographic projection of at least one of the plurality of dummy circuits on the base.