US 12,444,322 B2
Simulated blood vessel and ulcer model using same
Mutsumi Matsumoto, Tokyo (JP)
Assigned to DENKA COMPANY LIMITED, Tokyo (JP)
Appl. No. 18/290,076
Filed by DENKA COMPANY LIMITED, Tokyo (JP)
PCT Filed Mar. 23, 2022, PCT No. PCT/JP2022/013431
§ 371(c)(1), (2) Date Nov. 9, 2023,
PCT Pub. No. WO2022/239490, PCT Pub. Date Nov. 17, 2022.
Claims priority of application No. 2021-079812 (JP), filed on May 10, 2021.
Prior Publication US 2024/0282219 A1, Aug. 22, 2024
Int. Cl. G09B 23/30 (2006.01); G09B 23/28 (2006.01)
CPC G09B 23/303 (2013.01) [G09B 23/285 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A simulated blood vessel comprising a tubular substrate layer and a conductive layer disposed on at least a portion of an outer surface of the substrate layer, wherein:
the substrate layer is a substrate layer molded from a thermoplastic resin composition having a tensile modulus of elasticity of 0.01-50 MPa and a melting point of 50-200° C.; and
the conductive layer contains a conductive polymer.