US 12,443,781 B2
Integrated thermal-electrical co-simulation
Vijender Kumar, Bangalore (IN); Mallikarjun Vasa, Secunderabad (IN); Ashish Shrivastava, Bangalore (IN); Bhyrav Mutnury, Austin, TX (US); Seema P K, Bangalore (IN); Sukumar Muthusamy, Bangalore (IN); Sanjay Kumar, Ranchi (IN); and Sunil Pathania, Amb (IN)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Apr. 8, 2022, as Appl. No. 17/716,527.
Prior Publication US 2023/0325569 A1, Oct. 12, 2023
Int. Cl. G06F 30/392 (2020.01); G06F 119/06 (2020.01); G06F 119/08 (2020.01)
CPC G06F 30/392 (2020.01) [G06F 2119/06 (2020.01); G06F 2119/08 (2020.01)] 15 Claims
OG exemplary drawing
 
1. An information handling system, comprising:
a memory device configured to store machine-executable code, and including first data representing a thermal profile of a motherboard, and second data representing a circuit trace of the motherboard, the circuit trace providing a high-speed data interconnection between two or more circuit devices; and
a processor configured to determine an average temperature of the circuit trace on the motherboard based upon the first data and the second data, and to model a trace layout for the circuit trace on the motherboard based upon the average temperature, wherein the memory device further includes third data representing temperature correlated electrical parameters of the motherboard, and wherein the electrical parameters include at least one of a dielectric constant of a dielectric material of the motherboard, a loss tangent of a conductor material of the motherboard, and a resistivity of the conductor material.