US 12,443,255 B2
Scheduling jobs for processor-based nodes to regulate coolant flow temperatures
Torsten Wilde, Berlin (DE); Rob J. Rongstad, Chippewa Falls, WI (US); Peter A. Hansen, Spring, TX (US); Robert E. Mascia, Chippewa Falls, WI (US); Steven J. Martin, Plano, TX (US); Steven J. Dean, Chippewa Falls, WI (US); Harvey E. White, Jr., Spring, TX (US); and Brian T. Purcell, Spring, TX (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Mar. 8, 2023, as Appl. No. 18/180,390.
Prior Publication US 2024/0306352 A1, Sep. 12, 2024
Int. Cl. G06F 1/20 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/206 (2013.01) [H05K 7/20281 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
communicating a coolant flow between an inlet and an outlet of a coolant subsystem associated with a cooling domain to remove thermal energy from a plurality of processor-based nodes of the cooling domain, wherein the communication of the coolant flow has associated predefined parameters; and
regulating a temperature of the coolant flow at the outlet, comprising:
determining, based on the predefined parameters, a minimum collective power consumption by the processor-based nodes to maintain a temperature of the coolant flow at the outlet at or above a minimum threshold temperature; and
based on the minimum collective power consumption, scheduling jobs to be executed by the nodes.