US 12,443,253 B2
Electronic apparatus
Ryota Watanabe, Yokohama (JP); Qianyi Lu, Yokohama (JP); Jun Iwasaki, Yokohama (JP); and Masaaki Bandoh, Yokohama (JP)
Assigned to LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed by LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed on Aug. 29, 2023, as Appl. No. 18/457,514.
Claims priority of application No. 2022-183510 (JP), filed on Nov. 16, 2022.
Prior Publication US 2024/0160258 A1, May 16, 2024
Int. Cl. G06F 1/20 (2006.01); G06F 1/16 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC G06F 1/203 (2013.01) [G06F 1/1656 (2013.01); G06F 1/1698 (2013.01); H05K 7/20154 (2013.01); H05K 7/20336 (2013.01); H05K 7/2049 (2013.01); H05K 9/0022 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An electronic apparatus, comprising:
a chassis;
a heat generating body in the chassis;
an antenna in the chassis and capable of receiving radio waves;
an electronic part aligned with the antenna within the chassis; and
a cooling module having a plate-shaped metal part and which cooling module cools the heat generating body within the chassis,
wherein the cooling module includes a heat receiving member that abuts on the heat generating body, and an elastic member that presses the heat receiving member against the heat generating body,
wherein the metal part includes a shield wall interposed between the antenna and the electronic part,
wherein the shield wall is in the heat receiving member or the elastic member.