US 12,443,235 B2
Electronic device including printed circuit board module
Soohyun Seo, Suwon-si (KR); Moonchul Shin, Suwon-si (KR); Baekeun Cho, Suwon-si (KR); Sanghyuk Park, Suwon-si (KR); Nakhyun Choi, Suwon-si (KR); Jooyoung Kang, Suwon-si (KR); Myunghoon Kwak, Suwon-si (KR); Yangwook Kim, Suwon-si (KR); Hyunsuk Kim, Suwon-si (KR); Jookwan Lee, Suwon-si (KR); and Changryong Heo, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 15, 2023, as Appl. No. 18/110,076.
Application 18/110,076 is a continuation of application No. PCT/KR2022/014493, filed on Sep. 27, 2022.
Claims priority of application No. 10-2021-0160433 (KR), filed on Nov. 19, 2021; and application No. 10-2022-0011404 (KR), filed on Jan. 26, 2022.
Prior Publication US 2023/0195171 A1, Jun. 22, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01)
CPC G06F 1/1652 (2013.01) [G06F 1/1624 (2013.01); G06F 1/184 (2013.01); G06F 1/203 (2013.01); H05K 7/205 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing comprising a first housing and a second housing, the second housing configured to move relative to the first housing;
a flexible display supported by at least one of the first housing or the second housing and changeable in form of a display area based on a movement of the second housing relative to the first housing;
a board module disposed inside the housing; and
a seating portion configured to form a seating space receiving the board module and to support the board module,
wherein the board module comprises:
a plurality of circuit boards spaced apart from each other and comprising one or more electrical elements;
at least one interposer comprising at least a portion placed between the plurality of circuit boards and configured to electrically connect at least two circuit boards among the plurality of circuit boards; and
a heat dissipator that is part of, connected to, and/or disposed in, the interposer, and
wherein, in a state in which the board module is accommodated in the seating space, at least a portion of a surface of the heat dissipator contacts the seating portion so that heat generated in the plurality of circuit boards can be transferred to the seating portion.