US 12,443,116 B2
Machine measurement metrology frame for a lithography system
Ulrich Mueller, Berkeley, CA (US); David Arthur Markle, Pleasanton, CA (US); and Stephen F. Sporer, Berkeley, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Appl. No. 18/000,035
Filed by Applied Materials, Inc., Santa Clara, CA (US)
PCT Filed Jun. 15, 2020, PCT No. PCT/US2020/037801
§ 371(c)(1), (2) Date Nov. 28, 2022,
PCT Pub. No. WO2021/257055, PCT Pub. Date Dec. 23, 2021.
Prior Publication US 2023/0221658 A1, Jul. 13, 2023
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/7085 (2013.01) [G03F 7/70508 (2013.01); G03F 7/70725 (2013.01); G03F 7/70775 (2013.01); G03F 7/70791 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a slab;
at least one guiderail coupled to and extending along the slab;
a first shuttle disposed on the at least one guiderail;
a second shuttle disposed on the first shuttle; and
a metrology bar coupled to a bottom of a chuck that is disposed on the second shuttle, wherein each distal end of the metrology bar extends laterally beyond a perimeter of the chuck, the metrology bar comprising:
at least one first sensor coupled to at least one distal end of the metrology bar; and
at least one second sensor laterally inward of the at least one first sensor.