US 12,443,058 B2
On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real estate for effective thermal tuning
Chia-Pin Chiu, Tempe, AZ (US); Kaveh Hosseini, Livermore, CA (US); Omkar Karhade, Chandler, AZ (US); and Tim Tri Hoang, San Jose, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 31, 2022, as Appl. No. 17/710,716.
Prior Publication US 2023/0314850 A1, Oct. 5, 2023
Int. Cl. G02F 1/01 (2006.01); G02B 6/293 (2006.01)
CPC G02F 1/0147 (2013.01) [G02B 6/29395 (2013.01); G02B 6/2934 (2013.01); G02F 2203/15 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a laser transmitter, comprising:
a row with four bumps; and
a micro-ring resonator (MRR) in the row between a first bump and a second bump of the four bumps; and
a cavity below the MRR, wherein a diameter of the cavity is substantially equal to a spacing between the first bump and the second bump.