| CPC G02B 26/0858 (2013.01) [B81B 3/0086 (2013.01); B81B 2201/042 (2013.01); B81B 2203/0118 (2013.01); B81B 2207/07 (2013.01)] | 5 Claims |
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1. A MEMS device comprising:
a mirror section and a movable frame surrounding the mirror section;
a plurality of piezoelectric elements, the plurality of piezoelectric elements including an inner piezoelectric element provided inside the movable frame to move the mirror section and an outer piezoelectric element provided outside the movable frame to move the mirror section, and the outer piezoelectric element comprising plural piezoelectric elements forming a meander pattern and connected by a connection section;
a silicon substrate which has an insulating layer on a surface side thereof and which is composed of (i) a first region as a region where the plural outer piezoelectric elements are formed, and (ii) a second region comprising the connection section as a region where the plural outer piezoelectric elements are not formed;
an insulating film which covers the piezoelectric elements from the surface side; and
a plurality of wirings which are formed in a surface region of the insulating film in the first region and through which signals flow,
wherein:
each of the piezoelectric elements is composed of an upper electrode, a piezoelectric film, and a lower electrode in this order from a top thereof,
the second region includes a conductor layer, the insulating film, and the plurality of wirings extending from the first region and being stacked on the conductor layer,
the conductor layer in the second region is grounded, and
a grounding wiring extends in parallel to the plurality of wirings on a surface of the insulating film in the first region, the grounding wiring being connected to the conductor layer in the second region, and the grounding wiring being thicker than the plurality of wirings.
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