US 12,442,999 B2
Optically bridged multicomponent package with extended temperature range
Philip Winterbottom, San Jose, CA (US); David Lazovsky, Los Gatos, CA (US); Ankur Aggarwal, Pleasanton, CA (US); Martinus Bos, San Jose, CA (US); and Subal Sahni, La Jolla, CA (US)
Assigned to Celestial AI Inc., Santa Clara, CA (US)
Filed by Celestial AI Inc., Santa Clara, CA (US)
Filed on Apr. 4, 2025, as Appl. No. 19/170,583.
Application 19/170,583 is a division of application No. 18/742,028, filed on Jun. 13, 2024, granted, now 12,298,608.
Application 18/742,028 is a division of application No. 18/243,474, filed on Sep. 7, 2023, granted, now 12,124,095, issued on Oct. 22, 2024.
Application 18/243,474 is a continuation of application No. 18/123,083, filed on Mar. 17, 2023, granted, now 11,835,777, issued on Dec. 5, 2023.
Application 18/123,083 is a continuation of application No. 19/070,348, filed on Mar. 4, 2025.
Application 19/070,348 is a continuation of application No. 17/903,455, filed on Sep. 6, 2022, granted, now 12,271,595, issued on Apr. 8, 2025.
Claims priority of provisional application 63/448,585, filed on Feb. 27, 2023.
Claims priority of provisional application 63/321,453, filed on Mar. 18, 2022.
Claims priority of provisional application 63/420,330, filed on Oct. 28, 2022.
Prior Publication US 2025/0231432 A1, Jul. 17, 2025
Int. Cl. G01K 7/02 (2021.01); G01K 7/14 (2006.01); G02F 1/01 (2006.01)
CPC G02F 1/0123 (2013.01) [G01K 7/023 (2013.01); G01K 7/028 (2013.01); G01K 7/14 (2013.01); G02F 1/0113 (2021.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a package substrate;
a bridging element disposed in the package substrate, the bridging element providing an optical bridge to a die;
an analog/mixed signal (AMS) block coupled to the bridging element, the AMS block implementing data serialization and deserialization interfaces between the die and the bridging element;
a photonic network, disposed in the bridging element, comprising a plurality of photonic paths;
one or more modulators disposed in the bridging element, the one or more modulators being optically coupled to the photonic network and electrically coupled to the AMS block via a first set of one or more electrical interconnects;
one or more photodetectors disposed in the bridging element, the one or more photodetectors being optically coupled to the photonic network and electrically coupled to the AMS block via a second set of one or more electrical interconnects;
a multiplexer disposed in the bridging element, the multiplexer being optically coupled through the photonic network to the one or more modulators, and further optically coupled through the photonic network to an optical interface, wherein the multiplexer is configured to multiplex a first plurality of individual signals, received from the one or more modulators, into a first set of data channels that are transmitted over a first photonic path to the optical interface, wherein each data channel in the first set of data channels is defined by a unique wavelength; and
a demultiplexer disposed in the bridging element, the demultiplexer being optically coupled through the photonic network to the one or more photodetectors, and further optically coupled through the photonic network to the optical interface, wherein the demultiplexer is configured to demultiplex a multiplexed signal received from the optical interface over a second photonic path, the multiplexed signal comprising a second set of data channels, wherein the demultiplexer demultiplexes the multiplexed signal into a second plurality of individual signals that is transmitted over the photonic network to the one or more photodetectors, wherein each data channel in the second set of data channels is defined by a unique wavelength, wherein
the AMS block is aligned with the bridging element such that each of the one or more electrical interconnects in the first and second sets of the electrical interconnects is less than 2 mm in length.