| CPC G02F 1/0123 (2013.01) [G01K 7/023 (2013.01); G01K 7/028 (2013.01); G01K 7/14 (2013.01); G02F 1/0113 (2021.01)] | 20 Claims |
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1. A package, comprising:
a package substrate;
a bridging element disposed in the package substrate, the bridging element providing an optical bridge among a plurality of dies;
one or more analog/mixed signal (AMS) blocks coupled to the bridging element, the one or more AMS blocks configured for implementing data serialization and deserialization interfaces between the dies and the bridging element;
a photonic network, disposed in the bridging element, comprising a plurality of photonic paths;
a first photonic transceiver disposed in the bridging element, the first photonic transceiver optically coupled to the photonic network and electrically coupled, via a first set of one or more electrical interconnects, to the one or more AMS blocks;
a second photonic transceiver disposed in the bridging element, the second photonic transceiver optically coupled to the photonic network and electrically coupled, via a second set of one or more electrical interconnects, to the one or more AMS blocks;
an optical input disposed in the bridging element, the optical input providing an optical connection to light from an external device; and
a splitter disposed in the bridging element, the splitter coupled to the optical input via the photonic network and further coupled to the first and the second photonic transceivers via the photonic network, and wherein the splitter is configured for distributing the light over different photonic paths in the photonic network, wherein
the one or more AMS blocks are aligned with the bridging element such that each of the one or more electrical interconnects in the first and second sets of the electrical interconnects is less than 2 mm in length.
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