US 12,442,994 B2
Package structure having photonic integrated circuit
Chih-Chung Hsu, Zhubei (TW); Chih-Chung Wu, Hsinchu (TW); and Zuon-Min Chuang, Taoyuan (TW)
Assigned to Molex, LLC, Lisle, IL (US)
Filed by Molex, LLC, Lisle, IL (US)
Filed on Apr. 11, 2024, as Appl. No. 18/632,332.
Application 18/632,332 is a division of application No. 17/395,496, filed on Aug. 6, 2021, granted, now 11,988,867.
Claims priority of application No. 202010800803.0 (CN), filed on Aug. 11, 2020.
Prior Publication US 2024/0319438 A1, Sep. 26, 2024
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/30 (2006.01)
CPC G02B 6/4245 (2013.01) [G02B 6/12004 (2013.01); G02B 6/4204 (2013.01); G02B 6/424 (2013.01); G02B 6/4244 (2013.01); G02B 6/428 (2013.01); G02B 2006/12102 (2013.01); G02B 6/30 (2013.01); G02B 6/4206 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a substrate;
a first chip which is engaged to the substrate by flip chip;
a second chip which is positioned on the first chip;
an optical module which is in contact with the second chip and positioned between the substrate and the second chip; and
wherein the substrate has an optical module recessed portion, and the optical module extends into the optical module recessed portion;
wherein the optical module is electrically connected to both the second chip and the substrate.