US 12,442,990 B2
Technologies for coupling from photonic integrated circuits with an optical isolator
Alexander Krichevsky, Cupertino, CA (US); and Boping Xie, San Ramon, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2021, as Appl. No. 17/561,286.
Prior Publication US 2023/0204876 A1, Jun. 29, 2023
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4207 (2013.01) [G02B 6/4214 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a photonic integrated circuit (PIC) die comprising:
one or more waveguides, wherein the one or more waveguides are disposed near a top surface of the PIC die;
one or more flat mirrors disposed on a bottom surface of the PIC die, the bottom surface opposite the top surface;
one or more curved mirrors; and
one or more reflectors, wherein individual reflectors of the one or more reflectors are to reflect light from the one or more waveguides towards one of the one or more flat mirrors; and
an optical isolator,
wherein individual flat mirrors of the one or more flat mirrors are to reflect light from one of the one or more reflectors towards one of the one or more curved mirrors,
wherein individual curved mirrors of the one or more curved mirrors reflect light from one of the flat mirrors of the one or more flat mirrors towards the optical isolator.