US 12,442,982 B2
Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR) in an open cavity photonic integrated circuit (OCPIC)
Chia-Pin Chiu, Tempe, AZ (US); Kaveh Hosseini, Livermore, CA (US); Omkar Karhade, Chandler, AZ (US); and Tim Tri Hoang, San Jose, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 31, 2022, as Appl. No. 17/710,709.
Prior Publication US 2023/0314704 A1, Oct. 5, 2023
Int. Cl. G02B 6/293 (2006.01); G02B 6/12 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/29338 (2013.01) [G02B 6/12007 (2013.01); G02B 6/29395 (2013.01); H01L 25/167 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optoelectronic system, comprising:
a first substrate;
a second substrate over the first substrate;
a micro-ring resonator (MRR) over the second substrate;
a heater integrated into the MRR;
a cladding over the MRR; and
a temperature sensor over the MRR in the cladding.