US 12,442,897 B1
LIDAR system and manufacturing method having semiconductor-based optical components coupled together with solder
Lei Wang, Fremont, CA (US)
Assigned to AURORA OPERATIONS, INC., Pittsburgh, PA (US)
Filed by Aurora Operations, Inc., Pittsburgh, PA (US)
Filed on Nov. 27, 2024, as Appl. No. 18/962,722.
Int. Cl. G01S 7/481 (2006.01); H05K 1/02 (2006.01)
CPC G01S 7/4811 (2013.01) [H05K 1/0203 (2013.01); H05K 1/0274 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10378 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing a semiconductor-based light detection and ranging (LIDAR) system for a vehicle, the method comprising:
coupling a first optical component with solder disposed on a first portion of the first optical component to a second optical component, by inserting the second optical component in a through-hole of the first optical component in a first alignment operation wherein after the first optical component is coupled to the second optical component, the solder disposed on the first portion of the first optical component is not in contact with the second optical component;
applying heat to the solder disposed on the first portion of the first optical component to cause the solder disposed on the first portion of the first optical component to flow toward the second optical component and to come into contact with the second optical component;
coupling the first optical component to a third optical component with solder disposed on a first portion of the third optical component in a second alignment operation, wherein after the first optical component is coupled to the third optical component, the solder disposed on the first portion of the third optical component is not in contact with a second portion of the first optical component; and
applying heat to the solder disposed on the first portion of the third optical component to cause the solder disposed on the first portion of the third optical component to flow toward the first optical component and to come into contact with the second portion of the first optical component.