US 12,442,873 B2
Magnetic sensor, method of manufacturing magnetic sensor, and sensitive element assembly
Akira Sakawaki, Tokyo (JP); Daizo Endo, Tokyo (JP); Sho Tonegawa, Tokyo (JP); and Yasumasa Watanabe, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Filed by Resonac Corporation, Tokyo (JP)
Filed on Jun. 28, 2023, as Appl. No. 18/342,839.
Claims priority of application No. 2022-106078 (JP), filed on Jun. 30, 2022.
Prior Publication US 2024/0003996 A1, Jan. 4, 2024
Int. Cl. G01R 33/06 (2006.01); G01R 33/00 (2006.01); H01F 10/16 (2006.01)
CPC G01R 33/063 (2013.01) [G01R 33/0052 (2013.01); H01F 10/16 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A magnetic sensor comprising:
a substrate; and
at least one sensitive portion disposed on the substrate and having a longitudinal direction and a transverse direction, the sensitive portion sensing a magnetic field by a magnetic impedance effect, wherein
the sensitive portion includes a soft magnetic material layer composed of a soft magnetic material having uniaxial magnetic anisotropy in a direction intersecting the longitudinal direction, the soft magnetic material layer sensing the magnetic field, and a secondary soft magnetic material layer laminated between the substrate and the soft magnetic material layer, the secondary soft magnetic material layer being composed of a soft magnetic material with large saturation magnetization compared to the soft magnetic material constituting the soft magnetic material layer, and
the secondary soft magnetic material layer contacts the soft magnetic material layer.