US 12,442,835 B2
Probe card system, method of manufacturing probe card system, method of using probe card system
Ho-Ming Tong, Taipei (TW); and Chao-Chun Lu, Hsinchu (TW)
Assigned to ND-HI TECHNOLOGIES LAB, INC., Taipei (TW); and ETRON TECHNOLOGY, INC., Hsinchu (TW)
Filed by ND-HI TECHNOLOGIES LAB, INC., Taipei (TW); and ETRON TECHNOLOGY, INC., Hsinchu (TW)
Filed on Jul. 19, 2023, as Appl. No. 18/355,255.
Claims priority of provisional application 63/390,684, filed on Jul. 20, 2022.
Prior Publication US 2024/0027494 A1, Jan. 25, 2024
Int. Cl. G01R 1/073 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/20 (2006.01); G01R 3/00 (2006.01); G01R 31/00 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01)
CPC G01R 1/07342 (2013.01) [G01R 1/06783 (2013.01); G01R 3/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A probe card system, comprising:
a tester assembly;
a probe head body configured to couple with the tester assembly;
a first interconnection structure on a first side of the probe head body; and
a probe layer structure on the first interconnection structure on the first side of the probe head body which is configured to engage with a wafer under test (WUT),
wherein the probe layer structure comprises:
a sacrificial layer in connection with the first interconnection structure;
a bonding layer in connection with the sacrificial layer; and
a plurality of probe tips each in connection with respective conductive patterns exposed from the bonding layer and electrically coupled to the first interconnection structure,
wherein the sacrificial layer allows removal of the bonding layer and the plurality of probe tips via an etching operation.