| CPC G01N 33/005 (2013.01) [C23C 8/16 (2013.01); G01N 27/127 (2013.01); G01N 27/4075 (2013.01)] | 7 Claims |

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1. A method for making a zinc oxide thin film, comprising:
depositing a Zn metal thin film on a silicon wafer substrate; and
thermally oxidizing the Zn metal thin film at a temperature of 200 to 1,000° C. in the presence of a gaseous mixture comprising H2, H2O and O2 having an oxygen partial pressure in a range of 10−60 to 10−1 atm to form a zinc oxide nanostructured thin film on the silicon wafer substrate,
wherein the zinc oxide nanostructured thin film has a thickness in a range of 10 to 1,000 nm and is porous having first pores with an average pore size of 1 to 20 nm and second pores with an average pore size of 4 to 12 Å.
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