| CPC G01N 27/128 (2013.01) | 6 Claims |

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1. A MEMS gas sensor mount body comprising:
a MEMS gas sensor chip including:
a base having a cavity;
an insulating film that is provided on the base to cover the cavity and has an opening portion connected to the cavity;
a gas sensing unit provided on a region of the insulating film above the cavity; and
a plurality of pads that are provided on a region on the insulating film not above the cavity and are connected to the gas sensing unit; and
a printed circuit board including:
a gas introduction path; and
a plurality of connection terminals,
the MEMS gas sensor chip being mounted on the printed circuit board to cover the opening portion such that where the plurality of connection terminals are provided on the printed circuit board is coplanar with a portion of a main surface of the printed circuit board that overlaps the gas sensing unit as viewed in a direction perpendicular to the main surface, with the cavity and the gas introduction path overlapping as viewed in the direction perpendicular to the main surface, and with the plurality of pads electrically connected to the plurality of connection terminals, and
the gas introduction path being at least one groove that is formed on the main surface of the printed circuit board in a region other than a region directly faced by the gas sensing unit such that the at least one groove has a bottom surface that is recessed relative to the main surface and such that the at least one groove does not overlap the gas sensing unit as viewed in the direction perpendicular to the main surface.
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